JPS6190290U - - Google Patents
Info
- Publication number
- JPS6190290U JPS6190290U JP17610984U JP17610984U JPS6190290U JP S6190290 U JPS6190290 U JP S6190290U JP 17610984 U JP17610984 U JP 17610984U JP 17610984 U JP17610984 U JP 17610984U JP S6190290 U JPS6190290 U JP S6190290U
- Authority
- JP
- Japan
- Prior art keywords
- header
- bellows
- cooling
- stopper
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17610984U JPH0310704Y2 (en]) | 1984-11-20 | 1984-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17610984U JPH0310704Y2 (en]) | 1984-11-20 | 1984-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6190290U true JPS6190290U (en]) | 1986-06-12 |
| JPH0310704Y2 JPH0310704Y2 (en]) | 1991-03-15 |
Family
ID=30733706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17610984U Expired JPH0310704Y2 (en]) | 1984-11-20 | 1984-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310704Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
-
1984
- 1984-11-20 JP JP17610984U patent/JPH0310704Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
| US9743558B2 (en) | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310704Y2 (en]) | 1991-03-15 |
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